Pin Diodes and Varicap Diodes in New UTLP 1006 Leadless Package

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NXP’s ultra-thin leadless package (UTLP) platform for faster time-to-market, smaller form factor

The NXP ultra-thin leadless package (UTLP) platform uses a patent-pending etch process that produces a high silicon-to-footprint ratio, increasing overall performance with the same footprint and a profile as low as 0.4mm. The process also improves the package’s electrical, thermal and moisture resistance.

The very small footprint makes it ideally suited to space-constrained portable applications like mobile communications, PDAs and handhelds. The package has no leads, so it delivers very low parasitics and hence provides better RF performance than leaded and QFN packages. This expands its design-in range to include high frequency applications operating at up to 24GHz.

 

UTLP Internal Structure

 

The patent-pending etch process produces a lead frame that delivers relative freedom between the bottom and top layouts. This creates a high degree of flexibility for assembly formats, supporting techniques like multiple die, multiple leads with isolated die pads, re-routing and even fine-pitch flip-chip, which can enhance RF performance even further.

The package also makes board assembly easier. The footprint is compatible with JETA standard SC-101 and the package itself can be packed very efficiently, with as many as 15,000 units on a 7 inch reel.

To lessen its impact on the environment, the package uses RoHS-compliant green plastic.

 

FEATURES Low height (0.4mm) Small footprint Very flexible platform High silicon-to-footprint ratio Increased performance Footprint compatible with JETA standard SC-101 Very efficient packing (15,000 units per 7” reel) RoHS-compliant, green plastic

APPLICATIONS Improved electrical, thermal and moisture resistance Reduced noise Easier board assembly More functionality in a smaller space Excellent RF performance

 

 

 

 

BAP51LX

Planar PIN diode in a SOD882 leadless ultra small SMD plastic package.

 

FEATURES High speed switching for RF signals Low diode capacitance Low forward resistance Very low series inductance For applications up to 3GHz

APPLICATIONS RF attenuators and switches

 

 

BB178LX

The BB178LX is a planar technology variable capacitance diode in a SOD882T ultra small leadless plastic SMD package. The excellent matching performance is achieved by gliding matching and a Direct Matching Assembly (DMA) procedure.

 

FEATURES Excellent linearity Excellent matching to 2 pct DMA Ultra small leadless SMD package Cd(28V) : 2.6pF; Cd(1V) to Cd(28V) ratio typical 15 Low series resistance

APPLICATIONS Voltage Controlled Oscillators (VCO) Electronic tuning in VHF television tuners, Band B up to 460MHz

 

 

BB179LX

The BB179LX is a planar technology variable capacitance diode in a SOD882T ultra small leadless plastic SMD package. The excellent matching performance is achieved by gliding matching and a Direct Matching Assembly (DMA) procedure.

 

FEATURES Excellent linearity Excellent matching to 2 pct DMA Ultra small leadless SMD package Cd(28V) : 2.1pF; Cd(1V) to Cd(28V) ratio typical 9 Low series resistance

APPLICATIONS Voltage Controlled Oscillators (VCO) Electronic tuning in VHF television tuners

 

 

BB202LX

The BB202LX is a planar technology variable capacitance diode in a SOD882T ultra small leadless plastic SMD package.

 

FEATURES Very steep Capacitance-Voltage (CV) curve Cd(0V2): 30.5pF; Cd(2V3): 9.5pF Ratio Cd(0V2) to Cd(2V3) minimal 2.5 Ultra small leadless SMD package Low series resistance

APPLICATIONS Voltage Controlled Oscillators (VCO) Electronic tuning in FM radios Recommended as the reference VCO varactor for Philips Tuner ICs TEA5764, TEA5767 and TEA5768 in mobile and portable platforms

 

 

The Leading Document in the RF Market is now in its 9th Edition

 

What’s new?

We’ve added more applications, more products and more RF topics. The usual cross-reference, replacement and packaging information updates are still there. In addition, we’ve clearly highlighted recommended products to make it even easier to choose from our RF product portfolio.

Application Driven

The RF Manual is completely application-driven. It features application diagrams, recommended products and links to relevant application note. With the RF Manual, you have a quick and easy path from your application requirements to the most relevant products and descriptive application information.

Fully Interactive

Interactive features make the RF Manual a convenient gateway to all the information available on our RF systems. Just click on the product type or application note and you’ll be taken directly to the appropriate page on our website.

The download the latest version, click here.

 

 

 Featured Products

Part Number		Description	Data Sheet	App. Notes
BAP142LX T/R		Silicon PIN Diode
BAP50LX		Silicon PIN Diode
BAP51LX T/R		Silicon PIN Diode
BAP64LX T/R		Silicon PIN Diode
BB178LX T/R		VHF Variable Capacitance Diode
BB179LX T/R		UHF Variable Capacitance Diode
BB202LX T/R		Low Voltage Variable FM Capacitance Diode

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