High Power Inductor Innovation: Higher Performance in Smaller Spaces
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The EPCOS family of High Power Inductors (HPI) provides exceptional electrical performance in a package that saves board space. With HPI, circuit designers can optimize converter power density and minimize the number of phases required. |
Based on an optimized ferrite core and flat wire
winding technology self-terminated under the
core, HPI devices have a compact footprint and
the highest storage density in the industry. This
inductor innovation is characterized by:
- High current rating
- Extremely low resistance / high conversion efficiency
- Compact size / high energy storage density
- Lowest losses at high frequency
HPI devices extend the EPCOS inductor range to
current ratings up to 30A, as seen in Figure 1.
Although there are many applications for HPI,
these devices are particularly suited for DC-to-DC
converters, including POL (point of load) and
VRM (voltage regulator modules). HPI serves as
the output inductor, and because the performance
of the output inductor directly impacts overall
performance in these applications, the optimized
size and electrical characteristics of HPI
are advantages.
Figure 1: Inductance vs. current of power inductors and HPI
Flat Wire Enables Low Resistance,
High Efficiency, High Current Ratings
HPI could also stand for “Helical Power Inductor”
because flat wire is used for the coils, resulting in a
helical shape. Flat wire allows for more complete
copper utilization in the core window. The result
is less wasted space inside the core – and more
room for copper.
More copper means less resistance and less
resistance means higher circuit efficiency. Less
resistance also allows for higher current ratings of
the inductor itself.
Ferrite Material Provides Lower Core Losses
The EPCOS HPI family uses a ferrite core
material. Although alternative materials can result
in a higher (saturation) current rating, ferrite has
significantly lower core losses (see Figure 2).
Figure 2: Relative comparison of core loss of various materials
Gaining a Space Saving Advantage
HPI devices save significant space. Self leads
from the coil are rolled under the body or core of
the part. Using self leads minimizes board space
required for the inductor. A specially designed
insulator on the bottom core surface holds the
leads in position and isolates the leads from the
core body.
The new HPI product family offers eight standard
inductance values in two package height options.
In the 4.95mm height package, the range is .50µH
at 30A to 3.0µH at 13A. In the 5.95mm height
package, the range is .95µH at 25A to 3.90µH at
12A. And because the HPI family utilizes a gapped
ferrite core, unique values of inductance can be
offered when necessary.
The saturation current rating (Isat) in the table
should be considered only as a reference,
because parameters such as air flow, PCB layout,
self heating, core losses, etc. can impact current
value. EPCOS recommends that design engineers
evaluate performance in the final application.
Also, because no clear standard is available
and information provided by suppliers can vary
significantly, direct comparisons in the application
are recommended.
Featured Products
| Part Number |
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Description |
Data
Sheet |
App.
Notes |
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| B82559A112A13 |
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Helically Wound Power Inductor
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| B82559A142A13 |
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Helically Wound Power Inductor
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| B82559A222A13 |
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Helically Wound Power Inductor
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| B82559A242A13 |
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Helically Wound Power Inductor
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| B82559A302A13 |
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Helically Wound Power Inductor
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| B82559A392A13 |
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Helically Wound Power Inductor
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| B82559A501A13 |
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Helically Wound Power Inductor
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| B82559A951A13 |
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Helically Wound Power Inductor
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