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Infineon®-SMM310™ Silicon Microphone


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Infineon introduces the product line of the Silicon microphone. The microphone sensors are based on the new semiconductor MEMS (Micro Electro Mechanical Systems) technology in contrast to conventional microphones, which typically rely on the electret condenser technology.


The Silicon microphone consists of two chips combined in a single package. The MEMS chip is a capacitor made up of a stiff and perforated backplate and a flexible membrane on a Silicon substrate. It transfers the sound waves into capacity variations. The ASIC chip converts the capacity variations into an electrical signal.

 


 

FEATURES
  • Enhanced and cost-reduced manufacturability due to reflow soldering capability
  • Excellent reliability and no degradation at high temperature, humidity, shock and vibration
  • Small size and low current consumption
  • Good and long term stable audio quality
  • High power supply rejection ratio
  • Roadmap to smaller size and enhanced audio performance
  • Roadmap to further integration of application specific interfaces
APPLICATIONS
  • Consumer applications with special focus on mobile phones
  • Suitable for automotive, industrial or medical applications where microphones are directly assembled onto the PCB and where size as well as temperature immunity matter

SPECIFICATIONS
  • VDD (max): 3.3V
  • VDD (min): 1.5V
  • Signal-to-Noise: 59dB (A)
  • Distortion threshold: 110dB SPL
  • Current consumption I (typ): 70µA
  • Acoustic sensitivity:-42 dBV/Pa

 


Mobile Phone Application Example

 


Microphone Demonstrator Application Example

 


Sensitivity Diagram

 

Voted 2006 Product of the Year by ELEKTRONIC-Magazine readers

 

 

 Featured Products
Part Number   Description Data
Sheet
App.
Notes
 
SMM310E6433Z New Product Introduction Silicon SMD MEMS Microphone Analog Interface View PDF   Buy Now

refers to New Product Introduction

 

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