Infineon®-SMM310™ Silicon Microphone
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Infineon introduces the product line of the Silicon microphone. The microphone sensors are based on the new semiconductor MEMS (Micro Electro Mechanical Systems) technology in contrast to conventional microphones, which typically rely on the electret condenser technology. |
The Silicon microphone consists of two chips
combined in a single package. The MEMS chip is
a capacitor made up of
a stiff and perforated
backplate and a flexible
membrane on a Silicon
substrate. It transfers
the sound waves into
capacity variations. The
ASIC chip converts the
capacity variations into
an electrical signal.
FEATURES
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- Enhanced and cost-reduced manufacturability due to reflow soldering capability
- Excellent reliability and no degradation at high temperature, humidity, shock and vibration
- Small size and low current consumption
- Good and long term stable audio quality
- High power supply rejection ratio
- Roadmap to smaller size and enhanced audio performance
- Roadmap to further integration of application specific interfaces
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APPLICATIONS
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- Consumer applications with special focus on mobile phones
- Suitable for automotive, industrial or medical applications where microphones are directly assembled onto the PCB and where size as well as temperature immunity matter
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SPECIFICATIONS
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- VDD (max): 3.3V
- VDD (min): 1.5V
- Signal-to-Noise: 59dB (A)
- Distortion threshold: 110dB SPL
- Current consumption I (typ): 70µA
- Acoustic sensitivity:-42 dBV/Pa
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Mobile Phone Application Example

Microphone Demonstrator Application Example

Sensitivity Diagram
Voted 2006 Product of the Year by ELEKTRONIC-Magazine readers
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| Part Number |
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Description |
Data Sheet |
App. Notes |
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| SMM310E6433Z |
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Silicon SMD MEMS Microphone Analog Interface
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refers to New Product Introduction